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公司发展历程

发展历程 2019-05-09
发展历程 Development History
 
 
2004 年            2004 年 6 月 24 日公司注册成立.
                         The company was established in 24 June, 2004.
 
 
 
 
2006 年           研发出第一台侧泵 50W 半导体绿光激光器,成功应用于上海、郑州、广州等地大型激光表演市场.
                         The first side-pumped 50W semiconductor green laser has been developed and successfully
                         applied to large-scale laser performance markets in Shanghai, Zhengzhou and Guangzhou.
 
 
 
 
2008 年           成功研发 1MJ 端泵水晶内雕激光器;双脉冲绿光切割机,获得科技部创新基金奖励.
                         The company successfully developed 1MJ end-pump laser for crystal engraving and double
                          pulsed green cutting in 2008,won the Innovation Fund award of the Ministry of Science and    Technology.
 
 
 
                 
 
 
2010 年             1MJ 激光器在水晶内雕领域市场占有率 60%.
                         The 1MJ laser have 60% of the market in the crystal engraving areas in 2010.
 
 
 
 
2012 年            4000 ㎡新厂房竣工,OGS 触控显示屏激光玻璃切割/钻孔模组上市应用成功,填补国内空白.
                          In 2012, 4000_new factory building was completed, and the laser glass cutting/drilling module
                         of OGS touch screen was put on the market to fill the gap in China.
 
 
 
 
2016 年           皮秒激光脆性材料切割工艺及成套设备 研发成功
                      Picosecond laser brittle material cutting process and complete set of equipment have been successfully developed
   
 
 
 
 
 
2017 年            1mm 以下的薄玻璃切割和裂片工艺开发成功
                        The laser cutting and slitting process for thin glass under 1mm has been successfully developed
 
 
 
 
 
 
 
2018 年         1mm-6mm厚玻璃切割和裂片工艺开发成功
                      zhe technology of 1mm-6mm thick glass cutting and slitting has been successfully developed
                     纳秒玻璃钻孔小于30um崩边工艺开发成功
                     Nanosecond glass drilling less than 30um edge breakage process was successfully developed
                    30w紫外皮秒工艺应用开发成功
                    The 30w uv picosecond process has been successfully developed